nVent SCHROFF offers you a wide range of Card. Creation of a specific board-cage to integrate conduction cooled VPX boards into a ventilated chassis. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. It provides one XMC/PMC site, alternately used as a PCIbus 32-bit/66 MHz or as an XMC site with either a x4 or a. Part of our AoC3U-800 Series of rugged packaging solutions, the AoC3U-821 enables high slot count systems in a precision engineered chassis for 3U VPX and SOSA aligned plug in card payloads. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. This powerful 6 or 8-core processing module is dedicated to mil-aero edge-computing applications, where performance, efficiency and power management are required. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. This allows testing of the conduction cooled modules without going through the thermal chamber. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. DECISIVE PERFORMANCE. XMC. nVent SCHROFF offers you a wide range of Card Lok, Conduction Cooling and VPX Chassis. Boards are inserted in the back of the chassis in a vertical orientation. Item/Part Number: 1940000376-0000R Product Features. Sarsen Technology supports a range of high performance computer graphics hardware based on NVIDIA and AMD technology for applications including GPGPU computing, video capture and processing, Artificial Intelligence (AI), and data archiving. LOWER RISK. The XPand1303 is a low-cost, flexible, development platform. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). Documentation. LoC3U-510 Extends System Cooling Capacity. 5 Air Flow Through standards that may prevent the. Data Plane. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane. DescriptioN sa - staNDarD commerciaL vX3920 vX3920-sa-B1a00 3U VPX 10/40 GbE Switch, full managed L2, L3, QoS, Multicast, IPv6. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your. 0-inch pitch • Meets VITA58 specification with multiple sizes availableCooling. 8” Pitch (Conduction Cooled) VPX & PCIe Graphics Processor Operating Temperature (MIL-STD-810) NVIDIA Quadro RTX 3000 GPU (TU106 Turing Architecture) -40°C to 70°C (Rugged Air Cooled) Supporting DirectX 12, OpenGL 4. Depending on local conditions, packaging and freight charges might not be included. Conduction-cooled modules include an additional 10/100Base-TX port available on the rear VPX connector. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. It is available in air-cooled and conduction-cooled versions. This rugged chip-down VPX card brings the power of NVIDIA and CUDA without a. 0 in. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. or 1. Front Panel: 2x 10G SFP+. (W) x 5. Conduction cooled, ruggedized to MILSTD810, with standard conformal coating (other on request) Operating temperature -40°C. Physical Characteristics. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. Failure to observe proper handling and installation procedures can6U, conduction-cooled VPX modules. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. or 1. Our Card and Software Packages are Designed for Fast, Portable Integrations. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. These rugged power supplies are available in 200W-1300W power configurations. In its default configuration, the XPand6200 Series Development Kit includes the XPand1508 I/O breakout stations. 8 in. 3 V. Conduction Cooled Enclosure : Model CC E-3VX4 Another Performance Design from the Team at Dawn Conduction Cooled Enclosure. The rugged. (604) 875-4405. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. Products includes conduction cooled, air over conduction cooled and liquid cooled solutions for applications requiring 1-slot to 18-slots. 1-2201-compliant conduction-cooled 3UVPX carrier card . Motorola – Single board chassis design with natural convection requirement. 1-1997. Description: The XPand1203 is a low-cost, flexible, development platform. The versatile design allows multiple customizable configurations based on proven components and design techniques. 0, with conduction-cooled and air-cooled versions, provide the assurance of mechanical ruggedization in COTS-based military systems. FREMONT, Calif. XIt1097 (90074535) - 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site XPand1007 (90075300) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the. The first100GbE 3U VPX SBC on the market aligned to SOSA 1; Up to 256 GB M. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. A onboard DC/DC converter. 2. Mobile workstation processor performance with enterprise-VPX Meritec Cable Module (Odd or Even) Daughter Card for Host board (Air or Conduction cooled). 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Acromag’s XMC-7K modules feature a high-performance user-configurable Xilinx® Kintex®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal management. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules (ANSI ratified October 2017) The environment in which the boards will be. FPGA Family. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Five slots 3U VPX conduction cooled Chassis. View product. Compare. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI alternatives or stick with VITA 48. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. Rugged Design Kit for development of 3U conduction-cooled VPX single board<br /> computers. 6"W x 9. NXP (formerly Freescale) MPC8640D Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer (SBC) The XPedite5170 is a high-performance 3U VPX-REDI single board computer based on the NXP (formerly Freescale) MPC8640D processor. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. Provides up to an 8-slot system for 3U convection cooled boards and 3U transition modules on 1. Accessories. 3 V. pitch;. Combine various standard components to create a Wedge Lok that satisfies your requirements. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. Conduction-Cooled Option. Related products. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. MicroTCA CompactPCI /-Serial PXI and PXI Express VME and VME64x VPX Systems Hardware Platform Management Components -. Ordering Information: Dawn P/N 11-1017632-01. Aisle Containment. The DK3 supports VPX development and integration activities for high speed C4ISR (Command, Control,. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. 0 in. These PSUs are available in 3U or 6U form factor. 8 in. Combined with IC’s ComEth4582a 10 Gigabit Ethernet router or hybrid ComEth4410a switch (PCIe & Ethernet) and other IC’s Processor/FPGAs boards with. AoC3U-610 Conduction Cooling with Air Assist. 34. Both XMC and PrPMC interfaces are active simultaneously. 3 to the P15 connector for interfacing with the host module. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Features & Benefits. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. 2. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. Fault monitoring and control. The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. 3V auxiliary Parallel operation capable with proprietary wireless. The VPX Timing Clock offers a complete solution set for all PNT needs. ,Ltd. Reviews aren't verified, but Google checks for and removes fake content when it's identified. 3 V @ 9 mA to 60 mA) 1 PPS Output: TCXO OCXO OCXO Rugged Option (VPX only) Accuracy to UTC (1-sigma locked to GPS) ±50 ns ±50 ns ±25 ns Holdover (constant temp after 2 weeks of GPS lock) After 4 hours 12 μs 3 μs 1 μs After 24 hours 450 μs 100. 6. The COOL-CC3 chassis is a 6-slot, 3U, VPX, forced-air, conduction-cooled portable tower chassis ideal for lab development. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. M4067 is a military grade 6U VPX, 115VAC 3 phase, AC-DC PSU card that provides six outputs per VITA 62 and is rated at 700W output power. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. 65 in. 0 Serial: 2 RS-232/422/485 SATA: 6 eSATA. Integrated security features for reliable, secure data transmission. Level 1-5 Air, Conduction Cooled. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. The heat from the internal conduction-cooled modules is. 3VIO, Short tail connectors on J1, long tail connectors on J2. American National Standards Institute, VITA Standards Organization. 350 W VITA 62 PSU-Conduction Cooled. 4 PCI Express on VPX Fabric Connector VITA 46. The 3U VPX to PCIe Adapter acts as a PCIe switch, providing an electrically and mechanically optimized interface between PCIe boards and VPX systems. The ANSI Standard ANSI/VITA 48. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. It supports up to two 0. 4. It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. 3V, 5V, +12V_Aux, -12V_Aux & 3. Item/Part Number: 1940000446-0000R Product Features Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Verifies chassis can meet power requirement and. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. Contact factory for appropriate board configuration based on environmental requirements. Systems based on ANSI/VITA 48. The XChange3012 is a conduction- or air-cooled 3U VPX module that provides both PCI Express and Ethernet switches. Development chassis for VPX and SOSA aligned module payloads. 84 W Weight Conduction cooled: 535. Form Factor: 3U VPX. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. REDI – FORM FACTORS REDI recommends two Board Sizes as 3U [100mm X 160mm] and 6U [233. The SP306R-VPX StorePak™ is a removable single slot air-cooled 3U VPX storage module designed to be used either in conjunction with Critical I/O’s StoreEngine storage manager, or as a stand-alone Direct Attach Storage device. 5” x 7. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction. VStream-VPX Datasheet Order Enquiry for VStream-VPX. Related links and. Grabcad 3U Vita Card. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. High performance 3U or 6U single board computers feature air or conduction-cooled options. 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. Available in fixed or removable configurations, with high performance PCIe/NVMe or low power SATA interfaces, and in air cooled or conduction cooled modules. VITA 48. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. August 2021 – Norristown, PA – LCR Embedded Systems has released two new conduction cooled chassis for high speed VPX systems. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. This enables the VX305H-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. Formally known as ANSI/VITA 48. Operating Temperature: -40C to +85C. conduction or air-cooled modules. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. This platform supports up to eight 0. 4mm; Weight: To be Announced;Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 's 6U VPX Load Board in a conduction-cooledformat is designed per the IEEE standard 1101. 100 Ohm differential pair routing. 400 Watts output power over a wide temperature. View product. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. 4 mm Compliant with the VITA 78 SpaceVPX standard For lab variant: Air-cooled metals For flight variant: Conduction-cooled metals Up to 12 Rx/Tx mid-board fiber transceivers System Manager FPGA For lab variant: ACT-H3KI-CG624: ProASIC3: A3PE3000-2FG896iPCI-SYSTEMS Inc. As system density has increased, the need for more aggressive and innovative thermal management techniques are needed. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. 30 in. 2 conduction cooled modules. The sensor platform is based on a 3U, 5-slot, conduction-cooled VPX chassis that houses two Eclipse RXR6322 or RXR6332 receivers, one REF6301 GPS-based reference, one Intel Corei7-based single board computer, and a plug-in. This platform supports up to eight 0. Air-cooled, conduction-cooled and REDI versions; 3U Single XMC slot; PCIe x8 Gen 2 interface; The VPX4812A can be used as a VPX switch card allowing a host CPU to communicate with up to 3 downstream cards in addition to the XMC card. Three tri-color front panel LED’s to. Acromag VPX products are designed for COTS applications. or 1. 8 in. 3. Conduction-Cooled Option. Air and conduction cooled options; Made in the USA; New products aligned with SOSA™ Technical Standard; VxWorks, Linux, and Windows support. The 3U VPX XMC Carrier is a rugged conduction cooled single slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCIexpress 1x 8lane or 2x4 lane configurations. 3 V Aux contactus@redrock. XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites; XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O; XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors. PXI / PXIe Chassis. Elma Bustronic Corp. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). This 3U VPX payload slot module can be used to extend the PCIe bus to any other PCIe based. 0 in. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. pitch conduction-cooled VPX (VITA 48. 3 V. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. 2 Type 2, Secondary Side Retainer. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. FREMONT, Calif. PSC-6236 Product Datasheet. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5. DECISIVE PERFORMANCE. The development kit includes the cables needed to connect the XPand6200. The chassis is also designed for plug in cards in alignment with the SOSA technical standard. Features include OpenVPX. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. Up to 32GB of high-speed. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. Conduction or air cooling. The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. 0 in. 6 Gigabit Ethernet Control Plane on VPX VITA 46. The VPX3-663 combines a PCIe Gen 3. 2 struggles to dissipate the attendant heat using straight conduction cooling. 0 in. Accessories. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. The DCMs pro-vides RF to IF conversion (where necessary), pre-selection, and gain equalization. 3U VPX carrier card. or 1. Select one of the products below to see specifications and learn more. Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. Signal rate: 3. Power Supplies. Alignment keying headers provided for extender and plug-in card. 3 Slot to 5 Slot each. Up to 20 CFM of airflow is provided per slot. 3V, 5V, +12V_Aux,State of the Art Power Technology VPX Power Supply. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Physical Characteristics. close. It supports up to two 0. LXH0000523: VPX 3U Load Board - Air cooled: NA. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. The VPX-REDI specifications of VITA 48. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. com Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. pitch air-cooled VPX (VITA 48. Revolutionary design allows for up to 175 watts per slot of conduction cooling. Length: 160 mm. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. 0. 8 in. Table 1 below shows the significant increase in board power consumption over. Up to 1080p30 or 1080i60. Clear all Compare. or 1. It features dual 9 slot backplanes including PSU slots. Software. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. 125 Gb/sec. True 6 Channel supply provides full Open VPX support. Level 4-5 Conduction Cooled 1; Levels 1 through 3 and 5 – Air, Conduction Cooled 1; Rugged 1; View Product Finder 2017, display Page: Maximum Memory. 0” pitch card spacing, and the Chassis I/O PWB uses standard D38999 Series Connectors for SBC and Graphics I/O, System I/O, Test/Software. Conduction cooled 3U VPX module; Mechanical. The XPand1203 is a low-cost, flexible, development platform. Works With: Subracks; Cases. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. The. The 3U VPX backplane uses standard 1. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. A pass-through backplane is also available, enabling the application developer to cable any desired topology. 9"L x 5. The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Kintex® UltraScale™ family of FPGAs. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A Technology: VPXVPX336 / VPX340 are State-of-the-art, rugged VITA62 compliant 3U/0. For all rugged environments: Air, Land, and Sea. Metal frames under the electronics that serve as heat spreaders to move heat to the card edge; Card retainer clamp/wedge lock to mechanically and thermally attach the card to the chassis3U VITA 62 compliant universal AC input 400 watt 6 channel plug-in or bulkhead mounted power supply for air or conduction cooled OpenVPX systems. 1 PICMG 2. Slots. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. VPX7650. 85" or 1. A x8 PCI Express 2. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. 0 port is routed per VITA 42. 3U CompactPCI 2. 0) is a widely adopted VPX-based standard which builds on the great success VME systems have had in this arena. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. The chassis combines forced air with conduction cooling to dramatically increase thermal. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. (H) Four 0. CCG-6860 Conduction Cooled Card Guide. ] Air-over-conduction design. 10 RTM slots for accessing I/O from the corresponding 3U VPX modules installed in the XPand6200 Series. 0 port is routed per VITA 42. SolidWedge™. XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. The DK3 is part of the LCR family of benchtop development solutions supporting VPX system development and the hardware convergence and interoperability initiatives of the US Department of Defense. 350 W VITA 62 PSU-Conduction Cooled. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. 3U Switch. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. A conduction-cooled option is available for more rugged operating environments. Load sharing circuitry for up to 4 modules. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules, (ANSI. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. 48. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. 2 conduction cooled modules because of their established deployment track record. 3U VPX – OpenVPX Backplanes3U VPX rugged ATR chassis systems supporting up to six modules, designed to meet the rigorous standards of MIL-STD-810F/G and DO-160. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. Conduction-cooled, rugged 3U VPX form factor. The system leverages LCR’s 600 Series AoC3U-620 chassis for VITA 48. ANSI/VITA 48. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. 3U VPX Embedded SBCs offering unparalleled performance from cutting-edge Intel or NXP (Freescale) processors & features like integrated FPGAs & SecureCOTS™. The panels on both the front and rear slots are removable for ease of probing and debugging. It features a FMC+ slot. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. Cooling: Conduction cooled. XChange3000. It supports up to two 0. Available in standard air-cooled and conduction-cooled rugged form factors;The ADC-VPX3-7Z1 is an Open VPX compliant XMC carrier designed to host the Alpha Data ADM-XRC-7Z1 Zynq based mezzanine card. As cards reach up to 170 W densities, they are exceeding the single-slot capability that a conduction-cooled card can handle, especially when several of these high-powered cards are used in adjacent slots in a system (depending on. 2 (REDI) and VITA 65 (OpenVPX™). Convection Cooled: SMA Jack (+3. They are low-power system-on-chip (SoC. The PX3030 is a conduction-cooled single-board computer offering an industry-leading combination of processing power and functionality in a 3U VPX-REDI module. High Performance Embedded Computing. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. It supports up to two 0. or 1. 5"L x 5. Curtiss Wright. . Power and reset LEDs are provided for system status. 85 and 1. 3U OpenVPX™ form-factor (VITA65) Xilinx Kintex-7 325T/410Tuser-programmable FPGA. 7W. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. Both are designed to support a minimum of ten 0. 8 in. 2 Conduction. The SBC3511 is the first of several new single board computers – 3U and 6U VPX - based on Intel’s latest processor that will be launched in the coming months. It is designed for use in deployed industrial and military applications in harsh environments. Removable drive modules rated for 100,000 mating cycles. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. Boards are inserted in the back of the chassis in a vertical orientation. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. Elma’s conduction cooled power supply modules are designed to meet the requirements of VITA 62 for use in harsh environments. 26 GHz, up to 8 GB of RAM, and up to 16 GB of Flash storage the PX3030 provides the processing. View.